Call for Papers
Abstract Submission
Abstract Submission will open in November, 2012. Abstracts will be Due on January 7, 2013.
Abstract Submission has been extended to January 17th, 2013.
Authors will be notified of the outcome of the review process by 1 April, 2013.
Download First Call for Papers in PDF Form here.
TECHNICAL SCOPE
Abstracts representing high quality original research are desired
for both poster and oral presentation in the following areas:
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- Extreme UV lithography
- Electron and ion beam lithography
- Advanced optical lithography
- Metrology and imaging
- Resists and resist processing
- Plasma etching and deposition
- Nano-fabrication techniques
- Maskless lithography
- Nano-imprint lithography
- Soft lithography and embossing
Topics in nanostructures and emerging technologies include:
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- Simulation and modelling for the nano-scale
- Nano-photonics
- Patterned media and data storage
- Nano‑electronics
- Nano-biology
- Micro- and nano-scale MEMS
- Micro- and nano-fluidics
- Self-assembly and directed self-assembly
- Nanofabrication for energy sources
- Atomic and Molecular manipulation
The quality of the abstracts will form the basis for selection of papers for the conference
and will be peer reviewed according to the following criteria:
- Originality of work
- Specific results achieved and described
- Potential impact and interest to the attendees
Abstracts are limited to one page of text (12 point or larger type) and a second, optional page with up to four figures.
To download an example of a formatted abstract, click here.
Late submissions may be considered but only if they report truly outstanding results.
Earlier notification will be provided to those authors providing an e-mail address.
Abstract submission will be available online at the following location:
www.softconf.com/d/eipbn2013/
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MICROGRAPH CONTEST
On a less technical level, EIPBN offers the opportunity to immortalize your favorite micrograph(s).
Categories and previous winners are described in more detail at the Micrograph Contest page.