Greg Wallraff

Materials for Advanced Lithgraphy

Materials for Advanced Lithgraphy

SESSION: Short Course
DATE: Tuesday, May 28, 2019
TIME: 11 am – 12 pm
LOCATION: Nicollet D

Abstract:
This short course will describe the development and applications of chemically amplified resists from the beginnings of deep ultraviolent lithography to today’s EUV resists. Emphasis will be on the properties and chemistry of these materials and how resist design determines lithographic performance. Included will be a discussion of alternative patterning technologies such as multiple patterning, DSA and nanoimprint. New inorganic resist materials and the special challenges facing the development of EUV resists for the sub 7 nm nodes will be addressed.


Bio:

Gregory Wallraff is a staff scientist at the IBM Almaden Research Center in San Jose, CA. He joined IBM in 1987 after receiving a PhD in Physical Organic Chemistry from the University of Utah. Since then he has worked several areas of technology with a focus on photoresists for semiconductor manufacturing. He has 120 publications and 39 patents.