EIPBN23
EIPBN23

Invited Speaker

Wen-Di Li

The University of Hong Kong

Wafer-scale structural coloration using interference lithography and grayscale-patterned secondary exposure

Zhuofei Gan, Hongtao Feng, Chuwei Liang, Wen-Di Li (The University of Hong Kong)

A high-throughput and wafer-scale nanopatterning method of interference lithography and grayscale-patterned secondary exposure is proposed that could spatially modulate nanostructure feature sizes on large scale while maintaining sufficiently high resolution. The method is demonstrated in the fabrication of wafer-scale structural color paintings.

About Wen-Di Li

Dr. Wen-Di Li is currently an Associate Professor in the Department of Mechanical Engineering at the University of Hong Kong, leading the Nanofabrication and Nanodevice Laboratory. Before joining HKU, Dr. Li received his bachelor’s and PhD degrees from Tsinghua University and Princeton University, respectively, and carried out post-doctoral research on advanced lithography for next-generation nanoelectronics at Hewlett-Packard Labs. His research interests mainly focus on high-resolution and scalable lithographic patterning and micro/nanofabrication techniques, such as sub-10 nm helium-ion-beam lithography, nanoimprint lithography, laser interference lithography, etc.,  from their fundamental mechanisms to process and instrumentation development. Recently, his group is also devoted to apply innovative lithographic fabrication techniques in flexible electronics and biomedical devices, and explore new patterning and processing methods for emerging materials like perovskites and 2D materials. The innovations from his team have been awarded gold medals twice at the Geneva International Exhibition of Inventions and licensed to spin-off companies, to commercialize flexible electronic devices and nanopatterning equipment, respectively.

Wen-Di Li