Conference

As semiconductor devices continue to shrink and become more complex, inspecting and measuring these structures at the nanoscale is increasingly challenging. Traditional inspection and metrology techniques often struggle to balance resolution, speed, and data coverage. This talk introduces hybrid inspection and electron‑beam (e‑beam) massive metrology as key technologies enabling advanced logic and memory manufacturing.

KLA’s Co-Intelligent Solutions leverage fast optical inspection with high‑resolution e‑beam techniques. Optical tools quickly scan entire wafers to identify areas of interest, while e‑beam inspection zooms in to capture fine details and sub‑nanometer defects. This hybrid inspection approach leverages integrated workflows and data analysis, enabling engineers to focus on detailed measurements where they are most impactful.

In this course we will also discuss how modern e‑beam systems can perform massive metrology—collecting dense, wafer‑scale measurements of critical features such as linewidths, contacts, and pattern fidelity. Real manufacturing examples demonstrate how these approaches accelerate learning, improve yield, and enable tighter process control, followed by a discussion of future challenges and opportunities.