Conference

Gijsbert Rispens

Senior System Engineer, ASML NV, Netherlands

Imaging in the Era of High NA EUV Lithography

With the shipment of the EXE:5200B system in 2025, ASML took the next step into the era of High NA EUV lithography. The increase in NA from 0.33 to 055 brings a step in resolution and pattern fidelity to enable further shrink of single expose patterning. In this talk I will introduce the EXE lithography system and roadmap. There will be special attention to the imaging improvements and challenges. I will show how ASML, in collaboration with the lithography ecosystem, works to optimize the imaging performance and takes the next steps into the era of High NA.

Gijsbert Rispens
Danilo De Simone

Danilo De Simone

Scientific Director at imec
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Dan Congreve

Dan Congreve

Electrical Engineering, Stanford University
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Thomas Stempel Pereira

Thomas Stempel Pereira

Business Development at Lab14
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Mona Jarrahi

Mona Jarrahi

Professor of Electrical & Computer Engineering, University of California Los Angeles
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