Conference

Gijsbert Rispens

Senior System Engineer, ASML NV, Netherlands

Imaging in the Era of High NA EUV Lithography

With the shipment of the EXE:5200B system in 2025, ASML took the next step into the era of High NA EUV lithography. The increase in NA from 0.33 to 055 brings a step in resolution and pattern fidelity to enable further shrink of single expose patterning. In this talk I will introduce the EXE lithography system and roadmap. There will be special attention to the imaging improvements and challenges. I will show how ASML, in collaboration with the lithography ecosystem, works to optimize the imaging performance and takes the next steps into the era of High NA.

Gijsbert Rispens
Julia W. P. Hsu

Julia W.P. Hsu

Texas Instruments Distinguished Chair in Nanoelectronics, Department of Materials Science and Engineering, University of Texas at Dallas
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Danilo De Simone

Danilo De Simone

Scientific Director at imec
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David S. Bergsman

David S. Bergsman

Assistant Professor, Department of Chemical Engineering University of Washington
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Maddison Coke

Maddison Coke

Senior Technical Specialist, University of Manchester
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