Gijsbert Rispens
Senior System Engineer, ASML NV, Netherlands
Imaging in the Era of High NA EUV Lithography
With the shipment of the EXE:5200B system in 2025, ASML took the next step into the era of High NA EUV lithography. The increase in NA from 0.33 to 055 brings a step in resolution and pattern fidelity to enable further shrink of single expose patterning. In this talk I will introduce the EXE lithography system and roadmap. There will be special attention to the imaging improvements and challenges. I will show how ASML, in collaboration with the lithography ecosystem, works to optimize the imaging performance and takes the next steps into the era of High NA.
Robert McLeod
Richard & Joy Dorf Endowed Professor, College of Engineering and Applied Science, University of Colorado Boulder
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Luca Basso
Researcher at the Center for Integrated Nanotechnologies, Sandia National Labs
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David S. Bergsman
Assistant Professor, Department of Chemical Engineering University of Washington
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Sourabh K. Saha
Assistant Professor and Woodruff Faculty Fellow, George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology
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