Conference

#	Topic	Poster Title	Author(s)	Affliation(s)	Abstract
P-160	2D Materials	Anisotropic Electrical Transport in Graphene Field-Effect Transistor Modulated by Sub-micron Gold Gratings	Wei-Yu Long, Yan-Yi Lin, Min-Da Yu and Chih-Ting Lin	National Taiwan University	By fabricating devices with currents flowing in different directions, we have demonstrated that periodic sub-micron gold gratings can effectively modulate the electrical properties of GFETs. This modulation induces a pronounced transport anisotropy. Ultimately, this work highlights the potential of precise nanopatterning to artificially tailor 2D materials for advanced electronic applications.
P-4	2D Materials	Design and Application of Titanium Dioxide Thin Films Guided Mode Resonance Filter	He Zhang, YiChen Ping and Yanli Li	Institute of Electrical Engineering, Chinese Academy of Sciences	The resonant wavelength of the device can be controlled while maintaining narrow linewidth characteristics by altering the refractive index of the titanium dioxide thin film of the optical waveguide layer. The wavelength control range spans 946.9–967.9 nm, with a full width at half maximum less than 0.8 nm.
P-106	3D nano & micro fabrication	Active Stabilization of the Cassie-Baxter State for Long-term Hydrophobicity	FNU Yuqing (1), Samuel Jia (1 2), Linyi Li (1 2), Jacob Jia (1), and Ke Du (1)	(1) University of California, Riverside, (2) Ohio State University	We present an active pneumatic replenishment system to combat biofouling by stabilizing the metastable Cassie-Baxter state. Utilizing closed-loop pressure control on high-resolution 3D-printed hydrophobic chips, our device prevents wetting transitions. Experiments demonstrate indefinite air-layer retention and significantly reduced algal biofilm formation, establishing a robust paradigm for long-term surface protection.
P-105	3D nano & micro fabrication	Development of 3D-Printed Hollow-Core Microneedles for Drug Delivery and Therapeutics in Mice Models	Jacob Thomas Waitkus, Yaneth Larios, Henry Yuqing and Ke Du	University of California at Riverside	Through 3D-printing of hollow-core microneedle patches, control over injection location and depth help to improve efficacy of injection-based drug delivery techniques. The design of a five-plane lancet needle tip aids in near-painless penetration of mice skin to deliver therapeutics directly at skin tumor sites or to inflamed muscles and joints.
P-161	3D nano & micro fabrication	High-Selectivity Ar/CF₄ Reactive Ion Etching of Colloidally Patterned Sapphire Nanostructures	Natalia A. Rueda Guerrero, Mehmet Kepenekci and Chih-Hao Chang	University of Texas at Austin	This work demonstrates a low-cost, scalable method to nanopattern sapphire using colloidal nanosphere templates, a nickel hard mask, and one-step Ar/CF4 RIE. The process achieves 300 nm-high structures with superior etch selectivity to common masks, enabling tunable, wafer-scale nanostructures for robust optical surfaces.
P-96	3D nano & micro fabrication	Laser-Assisted Fabrication and Multimodal Characterization of Si Microfunnel Structures	Jaidan Malloy, Ashif Chowdhury, Taehoon Kim, Jason Smith and Heayoung Yoon	University of Utah	Three-dimensional (3D) Si microfunnel arrays enhance light-matter interaction but face challenges in controllable fabrication and internal characterization. We demonstrate UV laser microdrilling and HNA etching with a controlled SiO2 cap, enabling tunable microfunnel evolution and quantitative 3D analysis via SEM and micro-CT for optoelectronic integration.
P-93	3D nano & micro fabrication	Rapid and Scalable Fabrication of Si Microfunnel Arrays Using Nanosecond UV-Laser and Selective HNA Etching	Ashif Chowdhury, Donggeon Kim and Heayoung Yoon	University of Utah	Perforated Si microfunnel arrays are fabricated by combining a nanosecond UV laser with isotropic HNA wet etching using a SiO2 cap. Controlled microdrilling and etch conditions tailor microfunnel geometry and optical response, enabling tunable translucent photovoltaic architectures. This approach offers a cost-effective, scalable route for diverse optoelectronic applications.
P-19	3D nano & micro fabrication	Self-Aligned Nanoscale Trench Etch In Silicon Using Mask Thickening With Convex Corner Lithography	C. Steenge (1), H. Veltkamp (1), Z. Ren (2), J.W. Berenschot (1), R.J.E. Hueting (1), N.R. Tas (1)	(1) MESA+ Institute, University of Twente, Enschede, (2) Oxford Instruments Plasma Technology	This work demonstrates self aligned nanoscale trench etching in silicon by combining convex corner lithography with a thickened thermal silicon dioxide mask. Mask thickening overcomes selectivity and thickness limits, enabling the formation of nanotrenches essential for scalable three dimensional nanodevice fabrication.
P-70	Advanced micro/nanolithography	Curved Metalens Fabrication on Objective Lens of Si Cooke Triplet for Aberration Corrected IR Imaging	Mason Risley, Charles Reinke, Brian John Redman, Corey Zheng, Amun Jarzembski and Bruce Burckel	Sandia National Laboratories	EBL Fabrication of nanostructured metalenses on curved silicon refractive lens to form hybrid diffractive refractive optics on a Cooke triplet lens. Metalens integrated Cooke triplet lens for IR imaging.
P-156	Advanced micro/nanolithography	Fabrication of Periodic Nanopillar Structures on Polycrystalline Diamond by Reactive Ion Etching	Dongju Lee (1), Xiang Zhang (1), Qing Zhu (2), Li Shi (2), Pulickel M. Ajayan (1), Chih-Hao Chang (2)	(1) Rice University, (2) University of Texas at Austin	Vertically aligned diamond nanopillars were fabricated using interference lithography-defined photoresist patterns and SiO₂ hard mask transfer, followed by oxygen-based ICP-RIE. The process enables controlled pattern formation on polycrystalline diamond, addressing etching challenges and demonstrating a scalable route for nanostructuring diamond surfaces.
P-84	Advanced micro/nanolithography	High-Throughput Ejection of Microdroplets via a Femtosecond Laser-Addressable Nanomembrane Array	Guannan Zhang and Wen-Di Li	University of Hong Kong	We propose a strategy to realize high-throughput ejection of microdroplets via a femtosecond laser-addressable nanomembrane array. A high-resolution nanomembrane array replaces conventional whole dynamically released layer (DRL) to first load microdroplets, and then these droplets are printed onto a receiving substrate using a low-energy femtosecond laser in high-throughput manner.
P-22	Advanced micro/nanolithography	Refining the Fabrication of Grayscale Lithography Annealed Resin Engineering	Gavin C. Gee	Sandia National Laboratories	We present insight into tuning the development process of a technique that uses a pyrolyzed grayscale resist pattern, converting it into a carbon mask, and developing the patterns on both AZ-4330 and ma-P 1275G photoresists.
P-32	AI for nanofabrication & Nanofabrication for AI	A Machine Learning Process for Flexible Inline Critical Dimensions Measurement from Micrographs	Jiahua Fan, Ziyu Wang, Pawan Vedanti and Gyuseok Kim	University of Pennsylvania	Accurate and efficient critical dimension measurements are important for nanoscale fabrication analysis. The development of machine learning algorithms have simplified the process to delegate repetitive and labor intensive manual measurements to an automated program. Here, we present a lightweight machine learning framework for flexible measurements.
P-24	Applications of Nanofabrication	An Electron Beam-Based Micro-LED Inspection Method	Yao Liu, Yanli Li, Huibin Zhao and Li Han	Chinese Academy of Sciences	To address limitations in contact-based Micro-LED wafer inspection—such as low speed, short probe lifespan, and chip damage—this study proposes an inspection method using electron beam. By irradiating the chip and adjusting beam parameters, we successfully drive the Micro-LED and obtain its I-V characteristics, experimentally validating the method's feasibility and effectiveness.
P-52	Applications of Nanofabrication	Perovskite Photovoltaics Utilizing a Conductive PCL/CNT Polymer	Luke J. Suttey (1), Samuel D. Triepke (1), Landon Guengerich (1), Jessica M. Andriolo (1), Jack L. Skinner (1), Dennis J. Moritz (2), John J. Borkowski (2)	(1) Montana Tech Nanotechnology Laboratory, (2) Montana State University	Fabrication methods and characterization of a photovoltaic cell utilizing single-walled carbon nanotubes and polycaprolactone composite electrode are presented. This work provides foundational data for the future fabrication of a triaxial electrospun perovskite solar cell consisting of the conductive polymer composite, a perovskite active layer, and a polymeric hole transport layer.
P-90	Applications of Nanofabrication	Tailoring HfOₓ ReRAM Switching Through Ti Interfacial Engineering	Zhijie Kong (1), Tsotne Gamsakhurdashvili (1), Daniel Sabrsula (2), Ana Cohen (1), David Barth (1), G. Karapetrov (1), and Lucas Barreto (2)	(1) Department of Physics, Drexel University, (2) Singh Center for Nanotechnology, University of Pennsylvania	This work studies Ti/HfOₓ interface engineering in HfOₓ-based ReRAM. By varying Ti thickness and post-deposition annealing, we analyze their impact on forming voltage, switching behavior, and resistance stability, demonstrating controlled optimization of resistive switching through interfacial modulation.
P-29	Electron Beam Lithography	A Fragment-based Pattern Prediction Method for Accelerating Large-Scale Mask Simulation	Ze-An Ding, Chun-Hung Liu, Yen-Hua Tu, Yu-Lin Chung, Yu Hsi Liu, Meng Gu Tsai and Nian-Ting Wu	National Taipei University	This study proposes a fragment-based pattern prediction method to address conventional FFT-based bottlenecks. By fragmenting layouts and incorporating time complexity analysis, the method achieves up to a 42% speed-up without compromising fidelity.
P-27	Electron Beam Lithography	A Hybrid Curvilinear Mask Process Correction Method Integrating Shape and Dose Modifications	Chun-Hung Liu, Nian-Ting Wu, Yu-Lin Chung, Sheng-Kai Wong, Ze-An Ding, Yen-Hua Tu, Huang Ting-Chun, Yu-Tang Sun, Meng Gu Tsai and Yu-Jun Zhong	National Taipei University	This study proposes a hybrid curvilinear mask process correction method integrating shape and dose modifications. By combining fast shape-based convergence with high-precision dose refinement, the approach significantly enhances both computational efficiency and pattern fidelity compared to conventional single-mode correction techniques.
P-26	Electron Beam Lithography	Accelerated Curvilinear Mask Process Correction via Direct Energy-based Modulation	Chun-Hung Liu, Yu-Lin Chung, Nian-Ting Wu, Sheng-Kai Wong, Ze-An Ding and Meng Gu Tsai	National Taipei University	This study proposes a direct energy-based modulation method for curvilinear mask process correction (CL-MPC). By performing modulation directly in the energy domain, it reduces iterations by 65% and runtime by 64%. The approach enhances computational efficiency while maintaining high pattern fidelity and smoother dose distributions.
P-30	Electron Beam Lithography	Application-Specific Fast Multipole Methods for Enhancing Computational Efficiency in Curvilinear Mask Pattern Prediction	Chun-Hung Liu, HSUN-MAO KUO, Ze-An Ding, Yen-Hua Tu, Huang Ting-Chun and Meng Gu Tsai	National Taipei University	An Application-Specific Fast Multipole Method and an SVD-enhanced version to accelerate pattern prediction in EBL is proposed. By optimizing field calculations and simplifying multipole processes, the proposed methods achieve linear scalability, showing a 93% runtime improvement and a 1,411% speed-up over conventional FFT method while maintaining negligible edge placement error.
P-28	Electron Beam Lithography	Energy-based Iterative Calibration of Parametric Point Spread Functions for Curvilinear Pattern Prediction	Chun-Hung Liu, Meng Gu Tsai, Yu-Lin Chung, Ze-An Ding, Sheng-Kai Wong and Nian-Ting Wu	National Taipei University	This study proposes an energy-fitting-based method that iteratively calibrates the parametric point spread function parameters by minimizing the error in the energy image, enabling accurate pattern prediction (PP) for curvilinear patterns. The mean of edge placement error is reduced by up to 66%, confirming that energy-deposition matching improves PP fidelity.
P-39	Electron Beam Lithography	Fabrication of Near-UV Multilevel Diffractive Lenses Using Grayscale E-Beam Lithography and TASTE	Cecilia R. Fasano, Chi C. Cheung and Marc Christopherson	Naval Research Laboratory	The evolution of grayscale lithography enables the creation of more complex 3D structures. We report on efforts to use grayscale electron beam lithography in combination with thermally activated selective topography equilibration to fabricate multilevel diffractive lenses in (PMMA) for use in the near-UV where PMMA exhibits high transmission.
P-16	Electron Beam Lithography	Quantitative Evaluation of Patterning Resolution Capability Using Partially Resolved Regions.	Aki Mukai, Yoshiyuki Negishi, Hideki Matsui, Yoshinori Kojima	NuFlare Technology, Inc.	In the conventional evaluation criteria, Isolated Space (IS) minimum resolution was evaluated whether the pattern penetrated into the bottom across the entire CD-SEM top-view image.This method is insufficient to show slight improvements. Therefore, we focused on the pattern partially resolved regions to determine a new method for quantification.
P-107	Electron/Ion Sources and Optics	Ion Implantation into Semiconductors using Ionic Liquid Ion Sources	Shaun Boodram, Alex Storey, Aydin Sabouri and Carla Perez Martinez	University College London	This work will present atom probe tomography (APT) data showing ion implantation into semiconductor substrates caused by irradiation with Ionic Liquid Ion Source (ILIS) beams. ILIS. ILIS are needle devices which utilise field evaporation to produce a beam of ions from ionic liquids, defined as room temperature molten salts.
P-6	Electron/Ion Sources and Optics	Transmission Electron Gain of Si₃N₄ Thin Films	Y. Ping, Y. Li, Y. Wu, Y. Liu, H. Zhao, L. Han	Chinese Academy of Sciences
P-142	Ion Beam Lithography	Characterizing Environmental Vibration Impacts on Electron-Beam Lithography Using Exposure-Induced Pattern Signatures	Jingyu Huang, Chenhui Deng, Bohua Yin, Li Han	Chinese Academy of Sciences	We propose a process-based method to quantify environmental vibration in electron-beam lithography by extracting edge displacement from printed nanopatterns and analyzing its frequency spectrum. Correlating vibration features with LER/LWR and placement errors enables in situ monitoring, sensitivity tuning via exposure parameters, and practical vibration mitigation without dedicated sensors.
P-80	Metamaterials, metasurfaces & flat optics	Enabling Rapid Nanofabrication of Large-Area Metasurfaces by Innovative Algorithmic EBL Patterning	Frank Nouvertne, Michael Kahl and Volker Boegli	Raith GmbH	Metalenses and metasurfaces enable compact flat optics but face severe EBL scaling limits due to massive GDSII data. A new algorithmic, formula-based EBL workflow generates patterns on-the-fly, drastically reducing data overhead and enabling rapid fabrication of large, complex meta- and other formula defined surfaces up to 50 mm in size.
P-14	Metrology, Microscopy	Aberration Measurement Using Imaging with Electron Beam Landing-Angle Sweeping	Zh. H. Cheng (1), S. Tanaka (1), K. Hitomi (1), H. Takayanagi (1), T. Iwatsuka (1), R. Kadoi (1), H. Dohi (2), M. Mita (2), H. Tanabe (2)	(1) Hitachi, Ltd., (2) Hitachi High-Tech Corporation	A novel fast aberration measurement method that combines imaging, based on two-dimensional sweeping of the electron beam landing angle on the sample, and image processing techniques, is proposed. The method is validated experimentally through measuring the excitation sensitivity of an aberration corrector incorporated into an SEM (Scanning Electron Microscope) apparatus.
P-117	Metrology, Microscopy	Automated SEM metrology workflows for lithography and nanofabrication	M. Chahid (1), A. Peyyety (2), P. Weber (2), S. Bauerdick (2), Z. Benes (1)	(1) École Polytechnique Fédérale de Lausanne, (2) GenISys GmbH	Automated SEM-based imaging and metrology workflows are presented for wafer-scale process characterization in shared nanofabrication facilities. Combining layout-based navigation, robust autofocus, and image-to-layout matching, the approach enables rapid inspection and quantitative CD metrology across large areas, demonstrated on 4-inch wafers for EBL, etching, and optical lithography processes.
P-99	Metrology, Microscopy	Efficiency Improvement of EUV Diffractive Optical Elements for High-Throughput Imaging	Weilun Chao, Farhad Salmassi, Sarath Samudrala, Martin Izquierdo and Eric M. Gullikson	Lawrence Berkeley National Laboratory	Diffractive optical elements (DOE) are powerful and versatile optics. In the presentation, we will discuss our long-term project of developing nanofabrication processes for EUV phase zoneplates with up to five-fold efficiency improvement.
P-56	Metrology, Microscopy	Method and Apparatus for Defect Analysis In-line Optical Scatterometry	Juan Faria Briceno and Steve Brueck	University of New Mexico	Roughly 20% of the processes in high-volume IC fabrication focus on metrology. New fabrication techniques such as roll-to-roll (R2R) processes are being developed for manufacturing large-area nanotechnology products such as wire-grid polarizers (WGP), metal-mesh grids, and metamaterials.
P-91	Metrology, Microscopy	Modeling Sputter Improves Particle Beam Microscop	Chibuike Ezeokoli and John Murray-Bruce	University of South Florida	We introduce a new modeling paradigm for particle beam microscopy that incorporates sample damage due to sputtering. Novel estimators for both single and time-resolved measurement are developed and analyzed. Damage-aware estimators are shown to outperform their damage-oblivious counterparts, with the damage-aware time-resolved maximum likelihood estimator achieving the best imaging performance.
P-38	Metrology, Microscopy	Prediction of Critical Dimensions of 3D Structures in CD SEM Metrology Based on LSTM Neural Network	Zheng Luo (1,2), Sa Liu (1,2), Delong Chen (1), Zhuming Liu (1)	(1) Institute of Semiconductors, Guangdong Academy of Sciences, (2) School of Electronics and Information Engineering, Wuyi University	To address the challenges of measuring the critical dimensions of three-dimensional structures with critical dimension scanning electron microscopy (CD-SEM), a cascaded model based on Long Short-Term Memory (LSTM) networks, which aims to enhance accuracy, is proposed. Results indicate that the predictive method has high accuracy.
P-135	Nanoelectronics	Optimization of Zirconium doped Hafnia-Based Ferroelectric Capacitive Memories via Thermal Annealing	Ziyi Wang, Tarun Maredla, Daniel Sabrsula, Ana Cohen, David Barth, and Lucas Barreto	Singh Center for Nanotechnology, University of Pennsylvania	We investigate the impact of thermal annealing on Zr-doped Hafnia capacitors. Devices are fabricated with varying annealing temperatures and durations to study their influence on phase transformation and ferroelectric performance. We measure hysteresis loops, PUND, and endurance behavior to evaluate remanent polarization, coercive field under different annealing conditions.
P-60	Nanofabrication for biology, nanomedicine & implantable devices	Cost-Effective Antimicrobial Surfaces Patterned by Interference and Nanoimprint Lithography	S. Triepke (1), L. Suttey (1), J. Andriolo (1), J. Skinner (1), B. Burckel (2)	(1) Montana Technological University, (2) Sandia National Laboratories	This work uses a custom low-cost interference lithography tool combined with nanoimprint lithography (NIL) to create surfaces that demonstrated effective antibiofouling and bactericidal properties. The pattern will be transferred to clear polycarbonate using NIL. Growth of Pseudomonas aeruginosa and Staphylococcus aureus will be quantified with confocal microscopy.
P-18	Nanofabrication for quantum	Integration of Electron-Beam Lithography and Atomic Layer Etching for Nanoscale Fabrication	Xinwei Wu, Jeremy Clark and John Treichler	Cornell Nanoscale Facility	We investigate Atomic Layer Etching (ALE) integrated with electron-beam lithography for sub-100 nm pattern transfer. Various ALE recipes using several industry-standard e-beam resists are evaluated for etch profiles, rates, and selectivity. The results provide insights on optimizing precision, selectivity, and damage control for nanoscale patterning and fabrication.
P-43	Nanofabrication for quantum	Nanofiber Gamma Ray Sensors via Lead-Based Perovskite Quantum Dots	Chase R. Benner (1,2), Xavier T. Vorhies (1,3), Kiyo T. Fujimoto (4), Jack L. Skinner (1), Jessica M. Andriolo (1,2)	(1) Montana Tech Nanotechnology Laboratory, Montana Technological University, (2) Mechanical Engineering, Montana Technological University, (3) Materials Science Ph.D., Montana Technological University, (4) Idaho National Laboratory	A study on the synthesis of CsPbCl3 quantum dots through the ion substitution of chloride into CsPbBr3 PQDs. The PQDs are dispersed in a variety of solvents and electrospun into a polymer fiber matt for use as a scintillating layer for gamma ray detection.
P-125	Nanoimprint Lithography	Fabrication of Antireflective Silver Mesh Electrode with Moth-Eye Structure by Combination of Photolithography and Nanoimprint Lithography	Takuto Wakasa and Jun Taniguchi	Tokyo University of Science	A novel process integrates moth-eye nanostructures into non-electrode regions of silver mesh transparent electrodes, preserving conductivity while significantly improving optical properties. Transmittance increases from 81% to 88% and reflectance decreases from 4.6% to 0.7%, enhancing visibility for touch panel and transparent electrode applications.
P-11	Nanoimprint Lithography	Fluorescence-intensity histogram characterizing uniformity of imprint resist patterns with different pattern-density distributions	Daisuke Tojima, Narumi Ono, Akiko Onuma and Masaru Nakagawa	Tohoku University	In this sturdy, fluorescent imprint patterns with different pattern-density distributions were fabricated via microprint and nanoimprint methods. The height distributions of the imprint resist patterns were visualized by fluorescence imaging. The fluorescence-intensity histograms allowed the characterization of differences in height uniformity of the imprint patterns.
P-10	Nanoimprint Lithography	Infiltration behaviors of trimethoxysilane derivatives into spin-on-carbon thin films analyzed by TOF SIMS	M. Nakagawa (1), K. Tsuchiya (1), R. Shishido (1), T. Hasegawa (1), A. Onuma (1), S. Itoh (2), K. Fukuzawa (2), R. Suzuki (3), J. Seki (3)	(1) Tohoku University, (2) Nagoya University, (3) Canon Inc.	In this study, we investigated the modification of spin-on-carbon (SOC) surfaces with adhesion molecules of trimethoxysilane derivatives to anchor nanoimprint resin patterns by time-of-flight secondary ion mass spectrometry (TOF-SIMS). The presence and absence of modification with 3-acryloyloxypropyltrimethoxysilane (AcPTMS) determines the feasibility of resist pattern formation.
P-83	Nanoimprint Lithography	Silicon Mold Improvement by Hydrogen Annealing for Low-loss PIC Fabrication Utilizing Nanoimprint Lithography	Lianyi Chen (1), Hui Wang (1), Wen-Di Li (2)	(1) University of Hong Kong, (2) Changzhou Smartcore Optoelectronic Limited	We fabricated silicon mold with hydrogen annealing and analyzed pattern roughness with SEM image processing. By comparing the power spectral density of the sidewall roughness of silicon molds, we found that during hydrogen annealing process the roughness with spatial frequency between 100 to 1000 nm has been suppressed.
P-134	Nanophotonics, Micro-optics, plasmonics	Challenges and optimization in using HSQ as etch mask for on-chip AlN waveguides fabrication for photonic devices	Bernadeta R. Srijanto, Bogdan Dryzhakov, Dayrl P. Briggs, Steven J. Randolph and Kyle P. Kelley	Center for Nanophase Materials Sciences, Oak Ridge National Laboratory	Pattern transfer in AlN photonics is challenged by the material's hydroxide-based developer susceptibility and reactive ion etch resilience, which renders conventional processing methods common to silicon photonics ineffective and necessitates several mitigation strategies. These challenges are overcome by optimizing EBL dose, adding protective stacks, and leveraging chemistry-dominant ICP-RIE.
P-76	Nanophotonics, Micro-optics, plasmonics	Fabrication of Waveguides on Porous Nanolattice Films for Low-Index Photonic Integration	Nayoung Kim and Chih-Hao Chang	University of Texas at Austin	To boost integrated-photonic waveguide confinement for VR/AR, we integrate mechanically robust, near-air-index porous nanolattice films beneath SU-8/SiO₂ waveguides. We fabricated waveguides on nanolattices using colloidal 3D lithography, ALD, planarization, photopatterning and controlled dry etching. We will discuss process modifications improving region targeting and etch reliability, enabling optical-loss and mode-confinement measurements.
P-63	Resists & materials	Choline Hydroxide as a non-toxic, metal-ion-free alternative developer to TMAH for Photoresists and HSQ	H. Biller (1), M. Sendel (1), D. Graf (1), P. Kohlschreiber (2), M. Gottwald (2), C. Helke (2), D. Reuter (2)	(1) Allresist GmbH, (2) Fraunhofer Institute for Electronic Nano Systems ENAS	Tetramethylammonium hydroxide (TMAH) is the predominant metal-ion-free developer used in the manufacture of semiconductors. However, it poses significant acute toxicity and environmental disposal challenges. Choline hydroxide, a chemically similar compound, presents a non-toxic alternative. This study evaluates its performance using positive and negative photoresists, as well as hydrogen silsesquioxane (HSQ).
P-167	Simulation, modeling, & design tools for nanofabrication	Extended reality activities for nanofabrication education	Joshua W. Stoner, Zhuolin Yang and Gina Adam	The George Washington University	Using Extended Reality (XR), we are focusing on enhancing the training experience for a memristor nanofabrication process flow. Leveraging spoken instructions, segmented views of the tool, and real-time feedback on student performance, this system aims to facilitate a comprehensive and multifaceted educational experience,
P-113	Simulation, modeling, & design tools for nanofabrication	Statistical Analysis of PECVD SiOₓ Deposition Rate and Refractive Index Using Design of Experiments	Tarun Maredla, Rohit Surikuchi, David Barth and Lucas Barreto	Singh Center for Nanotechnology, University of Pennsylvania	A 2⁴ factorial DOE was used to quantify how PECVD parameters affect SiOₓ thin film deposition rate and refractive index. Significant main effects and interactions revealed strong plasma-chemistry coupling, enabling accurate regression models and improved process control beyond one factor at a time tuning.

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