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Program

 

The conference runs 4 days: May 29 – Jun 1, 2012.  Activities begin on Tuesday afternoon with a special Commercial Session, which features exhibits by companies and organizations that provide tools and services of interest to the technology of the conference.  The Welcome Reception will be on Tuesday evening at the Hilton Waikoloa Lagoon Lanai.

TECHNICAL PROGRAM

The Technical Program runs Wednesday, May 30 through Friday, June 1.  The opening Plenary Sessionis on Wednesday morning with outstanding speakers presenting on major themes in advanced nanofabrication.  The Plenary Speakers this year are Mark Pinto (Applied Materials), Burn Lin (TSMC) and Matt Nowak (Qualcomm).

The session topics include:

Electron or Ion Beam Beam Lithography & Nanofabrication
Electron or Ion Sources and Systems
EUV Lithography
Optical Lithography w/ Masks
Maskless Lithography
Computation Lithography, Modeling, Simulation and CAD
Nano-Imprint, Soft Lithography
Resists
Metrology, Imaging and Alignment
Atomic, Molecular Scale, and Tip Based Processing
Nanofabrication: Directed Self Assembly
Nanofabrication
Nanostructures & Pattern Transfer
Nanomaterials: graphene, nanotubes, metamaterials and flexible electronics
Nano-Photonics, Plasmonics & Applications
Nano-Biology Applications
Nano-Electronics Applications
Emerging Technologies
Ultrahigh density data storage
Nano-MEMS

SPECIAL SESSIONS

EIPBN 2012 will also feature a number of special sessions on topics of current interest. These include graphene RF Electronics, 3DIC fabrication challenges, highly regular lithography, and nanostructured organic solar cells.

The EIPBN conference abstracts from the most recent years are available by clicking here

PROGRAM CHAIR

Dr. Michael Fritze
Director, Disruptive Electronics
Information Sciences Institute &
Research Professor
Ming Hsieh Dept. of Electrical Engineering
University of Southern California
3811 North Fairfax Drive, Suite 200
Arlington, Virginia 22203
(703) 812-3702 (Office)
Email: mfritze@isi.edu 

Please contact him should you have more questions on the details of the program.

TECHNICAL SECTIONS

The various technology sections and the Section heads that are contributing to the Program organization can be found by clicking here.


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